- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Attachment Method | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Attachment Method | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
1.500" (38.10mm) | Clip and PC Pin | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,040
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 10W H=1.5" BLK
|
1.500" (38.10mm) | Bolt On | 2.00°C/W @ 500 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
2.000" (50.80mm) | Bolt On and PC Pin | 1.00°C/W @ 700 LFM | 3.30°C/W |
