- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,063
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247, Multiwatt | 1.50°C/W @ 400 LFM | 2.70°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
17
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
60760 EXTRUSION 1X3.25"X4
|
Top Mount | Rectangular, Pin Fins | 48.000" (1219.20mm) | 3.250" (82.55mm) | Adhesive | - | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.50°C/W @ 400 LFM | 2.70°C/W | Black Anodized |
