- Series：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 2
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
711
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Bolt On and PC Pin | TO-220 | 0.472" (12.00mm) | 10.00°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-247 TO-264 TO-220
|
OmniKlip | Board Level, Vertical | Clip, Solder Foot | TO-220, TO-247, TO-264 | 2.362" (60.00mm) | - |
