- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Electus conditionibus;
Odonata Lepidoptera products 4
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
4,845
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
3,636
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ H=.45" BLK
|
Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
Adhesive | 0.450" (11.43mm) | 8.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 12.00°C/W @ 500 LFM |
