- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Output Type:
-
- Data Rate:
-
- Voltage - VCCA:
-
- Electus conditionibus;
Odonata Lepidoptera products 768
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of Circuits | Output Type | Data Rate | Input Signal | Channels per Circuit | Voltage - VCCA | Voltage - VCCB | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of Circuits | Output Type | Data Rate | Input Signal | Channels per Circuit | Voltage - VCCA | Voltage - VCCB | ||
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 8XSON
|
Tape & Reel (TR) | - | -40°C ~ 85°C (TA) | 8-XFDFN | 8-XSON,SOT996-2 (2x3) | 1 | Open Drain | - | - | 2 | 1V ~ 3.6V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
3,267
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 8XSON
|
Cut Tape (CT) | - | -40°C ~ 85°C (TA) | 8-XFDFN | 8-XSON,SOT996-2 (2x3) | 1 | Open Drain | - | - | 2 | 1V ~ 3.6V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
3,267
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 8XSON
|
- | - | -40°C ~ 85°C (TA) | 8-XFDFN | 8-XSON,SOT996-2 (2x3) | 1 | Open Drain | - | - | 2 | 1V ~ 3.6V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 16HXQFN
|
Tape & Reel (TR) | - | -40°C ~ 85°C (TA) | 16-VFQFN Exposed Pad | 16-HXQFN (3x3) | 1 | Open Drain,Push-Pull | - | - | 6 | 1V ~ 3.6V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
7,325
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 16HXQFN
|
Cut Tape (CT) | - | -40°C ~ 85°C (TA) | 16-VFQFN Exposed Pad | 16-HXQFN (3x3) | 1 | Open Drain,Push-Pull | - | - | 6 | 1V ~ 3.6V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
7,325
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 16HXQFN
|
- | - | -40°C ~ 85°C (TA) | 16-VFQFN Exposed Pad | 16-HXQFN (3x3) | 1 | Open Drain,Push-Pull | - | - | 6 | 1V ~ 3.6V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 14TSSOP
|
Tape & Reel (TR) | Automotive,AEC-Q100 | -40°C ~ 125°C (TA) | 14-TSSOP (0.173",4.40mm Width) | 14-TSSOP | 1 | Open Drain,Push-Pull | 50Mbps | - | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
NXP USA Inc. |
3,187
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 14TSSOP
|
Cut Tape (CT) | Automotive,AEC-Q100 | -40°C ~ 125°C (TA) | 14-TSSOP (0.173",4.40mm Width) | 14-TSSOP | 1 | Open Drain,Push-Pull | 50Mbps | - | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
NXP USA Inc. |
3,187
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 14TSSOP
|
- | Automotive,AEC-Q100 | -40°C ~ 125°C (TA) | 14-TSSOP (0.173",4.40mm Width) | 14-TSSOP | 1 | Open Drain,Push-Pull | 50Mbps | - | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
NXP USA Inc. |
9,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
IC TRNSLTR BIDIR 14DHVQFN
|
Tape & Reel (TR) | Automotive,AEC-Q100 | -40°C ~ 125°C (TA) | 14-VFQFN Exposed Pad | 14-DHVQFN (2.5x3) | 1 | Open Drain,Push-Pull | 50Mbps | - | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
NXP USA Inc. |
10,679
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIR 14DHVQFN
|
Cut Tape (CT) | Automotive,AEC-Q100 | -40°C ~ 125°C (TA) | 14-VFQFN Exposed Pad | 14-DHVQFN (2.5x3) | 1 | Open Drain,Push-Pull | 50Mbps | - | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
NXP USA Inc. |
10,679
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIR 14DHVQFN
|
- | Automotive,AEC-Q100 | -40°C ~ 125°C (TA) | 14-VFQFN Exposed Pad | 14-DHVQFN (2.5x3) | 1 | Open Drain,Push-Pull | 50Mbps | - | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
ON Semiconductor |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
IC TRNSLTR BIDIR 8MICROPAK
|
Tape & Reel (TR) | - | -40°C ~ 85°C (TA) | 8-UFQFN | 8-MicroPak? | 1 | Open Drain,Tri-State | - | - | 2 | 1V ~ 5.5V | 1.8V ~ 5.5V | ||||
ON Semiconductor |
6,681
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIR 8MICROPAK
|
Cut Tape (CT) | - | -40°C ~ 85°C (TA) | 8-UFQFN | 8-MicroPak? | 1 | Open Drain,Tri-State | - | - | 2 | 1V ~ 5.5V | 1.8V ~ 5.5V | ||||
ON Semiconductor |
6,681
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIR 8MICROPAK
|
- | - | -40°C ~ 85°C (TA) | 8-UFQFN | 8-MicroPak? | 1 | Open Drain,Tri-State | - | - | 2 | 1V ~ 5.5V | 1.8V ~ 5.5V | ||||
NXP USA Inc. |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 12WLCSP
|
Tape & Reel (TR) | - | -40°C ~ 125°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (1.20x1.60) | 1 | Tri-State,Non-Inverted | 100Mbps | - | 4 | 1.2V ~ 3.6V | 1.65V ~ 5.5V | ||||
NXP USA Inc. |
10,296
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 12WLCSP
|
Cut Tape (CT) | - | -40°C ~ 125°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (1.20x1.60) | 1 | Tri-State,Non-Inverted | 100Mbps | - | 4 | 1.2V ~ 3.6V | 1.65V ~ 5.5V | ||||
NXP USA Inc. |
10,296
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL 12WLCSP
|
- | - | -40°C ~ 125°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (1.20x1.60) | 1 | Tri-State,Non-Inverted | 100Mbps | - | 4 | 1.2V ~ 3.6V | 1.65V ~ 5.5V | ||||
Texas Instruments |
1,250
|
III dies |
-
|
MOQ: 250 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL SOT23-6
|
Tape & Reel (TR) | - | -55°C ~ 125°C | SOT-23-6 | SOT-23-6 | 1 | Open Drain,Push-Pull | 24Mbps | - | 1 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | ||||
Texas Instruments |
1,332
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRNSLTR BIDIRECTIONAL SOT23-6
|
Cut Tape (CT) | - | -55°C ~ 125°C | SOT-23-6 | SOT-23-6 | 1 | Open Drain,Push-Pull | 24Mbps | - | 1 | 1.65V ~ 3.6V | 2.3V ~ 5.5V |