7130DG

Description :
BOARD LEVEL HEAT SINK
Attachment Method :
Clip and PC Pin
Diameter :
-
Height Off Base (Height of Fin) :
0.610" (15.49mm)
Length :
1.025" (26.04mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-218
Power Dissipation @ Temperature Rise :
0.5W @ 20°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
4.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
23.10°C/W
Type :
Board Level, Vertical
Width :
1.005" (25.53mm)

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