7130DG
- Description :
- BOARD LEVEL HEAT SINK
- Hæc est pars Manufacturer
- Datasheet (1)
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- Attachment Method :
- Clip and PC Pin
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.610" (15.49mm)
- Length :
- 1.025" (26.04mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-218
- Power Dissipation @ Temperature Rise :
- 0.5W @ 20°C
- Series :
- -
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.00°C/W @ 500 LFM
- Thermal Resistance @ Natural :
- 23.10°C/W
- Type :
- Board Level, Vertical
- Width :
- 1.005" (25.53mm)