- Series：
-
- Operating Temperature：
-
- Mounting Type：
-
- Features：
-
- Height Above Board：
-
- Material Flammability Rating：
-
- Number of Positions：
-
- Contact Finish：
-
- Pitch：
-
- Contact Material：
-
- Housing Material：
-
- Flat Flex Type：
-
- Connector/Contact Type：
-
- FFC，FCB Thickness：
-
- Locking Feature：
-
- Actuator Material：
-
- Electus conditionibus;
Odonata Lepidoptera products 867
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Actuator Material | |
|
|
|
AVX Corp/Kyocera Corp |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,659
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,659
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
7,085
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
7,085
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
3,941
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
3,941
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
22,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
27,037
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
27,037
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 50POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 50POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
10,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 50POS 0.50MM R/A
|
- | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
Molex，LLC |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
Tape & Reel (TR) | Easy-On 502790 | -20°C ~ 85°C | Surface Mount，Right Angle | Double Contact，Solder Retention，Zero ion Force (ZIF) | 0.098" (2.50mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,686
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
Cut Tape (CT) | Easy-On 502790 | -20°C ~ 85°C | Surface Mount，Right Angle | Double Contact，Solder Retention，Zero ion Force (ZIF) | 0.098" (2.50mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
Molex，LLC |
6,686
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 50POS 0.50MM R/A
|
- | Easy-On 502790 | -20°C ~ 85°C | Surface Mount，Right Angle | Double Contact，Solder Retention，Zero ion Force (ZIF) | 0.098" (2.50mm) | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.30mm | Flip Lock | Polyphenylene Sulfide (PPS)，Glass Filled | ||
|
|
|
AVX Corp/Kyocera Corp |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 60POS 0.50MM R/A
|
Tape & Reel (TR) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 60 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - | ||
|
|
|
AVX Corp/Kyocera Corp |
4,890
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 60POS 0.50MM R/A
|
Cut Tape (CT) | 6288，Kyocera | -40°C ~ 105°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | 0.079" (2.00mm) | - | 60 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Plastic | FFC，FPC | Contacts，Bottom | 0.30mm | Flip Lock | - |
