Length:
Width:
Diameter:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Electus conditionibus;
Odonata Lepidoptera products 112,204
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Material Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
507302B00000G
Aavid, Thermal Division of Boyd Corporation
18,195
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 2.5W LOW PROFILE
- Board Level Aluminum Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - Bolt On TO-220 0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Black Anodized
507002B00000G
Aavid,Thermal Division of Boyd Corporation
51,138
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 BLK
- Board Level Aluminum Rectangular,Fins 0.700" (17.78mm) 1.750" (44.45mm) - Bolt On TO-220 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM 15.60°C/W Black Anodized
577102B00000G
Aavid, Thermal Division of Boyd Corporation
24,011
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK TO-220 .375" COMPACT
- Board Level Aluminum Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - Bolt On TO-220 0.375" (9.52mm) 3.0W @ 80°C 12.00°C/W @ 200 LFM 25.90°C/W Black Anodized
577202B00000G
Aavid, Thermal Division of Boyd Corporation
17,317
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK TO-220 .500" COMPACT
- Board Level Aluminum Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - Bolt On TO-220 0.500" (12.70mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Black Anodized
V5618A
ASSMANN WSW Components
6,712
III dies
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Top Mount Aluminum Rectangular, Fins 0.334" (8.50mm) 0.250" (6.35mm) - Press Fit 6-Dip and 8-Dip 0.189" (4.80mm) - - 80.00°C/W Black Anodized
504222B00000G
Aavid, Thermal Division of Boyd Corporation
14,552
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 PWR CLR 1.45"10W
- Board Level Aluminum Rectangular, Fins 1.450" (36.83mm) 0.780" (19.81mm) - Bolt On TO-220 (Dual) 0.850" (21.60mm) 4.0W @ 40°C 5.00°C/W @ 200 LFM 6.40°C/W Black Anodized
576802B04000G
Aavid, Thermal Division of Boyd Corporation
42,175
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK VERT PLUG-IN TO-220
- Board Level, Vertical Aluminum Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - Clip and PC Pin TO-220, TO-262 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Black Anodized
V-1100-SMD/B
ASSMANN WSW Components
18,400
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- Top Mount Copper Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
V-1100-SMD/B
ASSMANN WSW Components
18,715
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- Top Mount Copper Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
V-1100-SMD/B
ASSMANN WSW Components
18,715
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK ALUM DPAK TO-252
- Top Mount Copper Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - SMD Pad D2Pak, TO-252 0.390" (9.91mm) - - 25.00°C/W Tin
V2017B
ASSMANN WSW Components
25,551
III dies
-
MOQ: 1  MPQ: 1
HEATSINK ANOD ALUM CPU
- Top Mount Aluminum Square, Pin Fins 0.393" (10.00mm) 0.393" (10.00mm) - - Assorted (BGA, LGA, CPU, ASIC...) 0.275" (7.00mm) - - 31.00°C/W Black Anodized
573300D00010G
Aavid, Thermal Division of Boyd Corporation
12,250
III dies
-
MOQ: 1  MPQ: 1
HEATSINK D2PAK .4" HIGH SMD
- Top Mount Copper Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - SMD Pad TO-263 (D2Pak) 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Tin
573300D00010G
Aavid, Thermal Division of Boyd Corporation
12,300
III dies
-
MOQ: 1  MPQ: 1
HEATSINK D2PAK .4" HIGH SMD
- Top Mount Copper Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - SMD Pad TO-263 (D2Pak) 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Tin
573300D00010G
Aavid, Thermal Division of Boyd Corporation
12,300
III dies
-
MOQ: 1  MPQ: 1
HEATSINK D2PAK .4" HIGH SMD
- Top Mount Copper Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - SMD Pad TO-263 (D2Pak) 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Tin
501200B00000G
Aavid, Thermal Division of Boyd Corporation
18,047
III dies
-
MOQ: 1  MPQ: 1
HEATSINK 14-16 DIP BLACK .19"
- Top Mount Aluminum Rectangular, Fins 0.250" (6.35mm) 0.731" (18.57mm) - Thermal Tape, Adhesive (Not Included) 14-DIP and 16-DIP 0.190" (4.83mm) 0.4W @ 30°C 50.00°C/W @ 200 LFM 68.00°C/W Black Anodized
574902B03300G
Aavid, Thermal Division of Boyd Corporation
17,584
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT MNT W/TAB
- Board Level, Vertical Aluminum Rectangular 1.375" (34.93mm) 0.860" (21.84mm) - Clip and PC Pin TO-220 0.395" (10.03mm) 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Black Anodized
573300D00000G
Aavid, Thermal Division of Boyd Corporation
16,283
III dies
-
MOQ: 1  MPQ: 1
TOP MOUNT HEATSINK .4" D2PAK
- Top Mount Copper Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - SMD Pad TO-263 (D2Pak) 0.400" (10.16mm) 1.3W @ 30°C 8.00°C/W @ 300 LFM 18.00°C/W Tin
576802B00000G
Aavid, Thermal Division of Boyd Corporation
13,880
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 5W BLK
- Board Level Aluminum Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - Clip TO-220, TO-262 0.500" (12.70mm) 1.5W @ 40°C 7.00°C/W @ 400 LFM 27.30°C/W Black Anodized
593002B03400G
Aavid, Thermal Division of Boyd Corporation
10,440
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TWISTED FIN TO-220
- Board Level, Vertical Aluminum Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - Bolt On and PC Pin TO-220 0.500" (12.70mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Black Anodized
573100D00000G
Aavid, Thermal Division of Boyd Corporation
9,699
III dies
-
MOQ: 1  MPQ: 1
TOP MOUNT HEATSINK .4" D-PAK
- Top Mount Copper Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - SMD Pad TO-252 (DPAK) 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 15.00°C/W Tin