- Package / Case:
-
- Supplier Device Package:
-
- Mounting Type:
-
- Electus conditionibus;
Odonata Lepidoptera products 26
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Mounting Type | Number of I/O | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Mounting Type | Number of I/O | |
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Microchip Technology |
4,400
|
III dies |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Tape & Reel (TR) | 18-SOIC (0.295",7.50mm Width) | 18-SOIC | Surface Mount | 8 | |||
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Microchip Technology |
5,186
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Cut Tape (CT) | 18-SOIC (0.295",7.50mm Width) | 18-SOIC | Surface Mount | 8 | |||
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Microchip Technology |
5,186
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
- | 18-SOIC (0.295",7.50mm Width) | 18-SOIC | Surface Mount | 8 | |||
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Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Tape & Reel (TR) | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | 8 | |||
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Microchip Technology |
5,315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Cut Tape (CT) | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | 8 | |||
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Microchip Technology |
5,315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
- | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | 8 | |||
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Microchip Technology |
42,000
|
III dies |
-
|
MOQ: 2100 MPQ: 1
|
IC I/O EXPANDER 16BIT I2C 28SSOP
|
Tape & Reel (TR) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | 16 | |||
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Microchip Technology |
43,593
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 16BIT I2C 28SSOP
|
Cut Tape (CT) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | 16 | |||
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Microchip Technology |
43,593
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 16BIT I2C 28SSOP
|
- | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | 16 | |||
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Microchip Technology |
1,538
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Tube | 18-SOIC (0.295",7.50mm Width) | 18-SOIC | Surface Mount | 8 | |||
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Microchip Technology |
14,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28QFN
|
Tape & Reel (TR) | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | 16 | |||
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Microchip Technology |
15,128
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28QFN
|
Cut Tape (CT) | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | 16 | |||
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Microchip Technology |
15,128
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28QFN
|
- | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | 16 | |||
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Microchip Technology |
8,640
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Tray | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | 8 | |||
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Microchip Technology |
3,693
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20SSOP
|
Tube | 20-SSOP (0.209",5.30mm Width) | 20-SSOP | Surface Mount | 8 | |||
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Microchip Technology |
6,410
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28SOIC
|
Tube | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | Surface Mount | 16 | |||
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Microchip Technology |
5,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28SDIP
|
Tube | 28-DIP (0.300",7.62mm) | 28-SPDIP | Through Hole | 16 | |||
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Microchip Technology |
4,994
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28SSOP
|
Tube | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | 16 | |||
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Microchip Technology |
11,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 28QFN
|
Tube | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | 16 | |||
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Microchip Technology |
2,212
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18DIP
|
Tube | 18-DIP (0.300",7.62mm) | 18-PDIP | Through Hole | 8 |