- Applications：
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- Operating Temperature：
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- Package / Case：
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- Size / Dimension：
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- Capacitance：
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- ESR (Equivalent Series Resistance)：
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- Electus conditionibus;
Odonata Lepidoptera products 10
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Applications | Operating Temperature | Package / Case | Features | Tolerance | Size / Dimension | Capacitance | ESR (Equivalent Series Resistance) | Voltage - Breakdown | ESL (Equivalent Series Inductance) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Applications | Operating Temperature | Package / Case | Features | Tolerance | Size / Dimension | Capacitance | ESR (Equivalent Series Resistance) | Voltage - Breakdown | ESL (Equivalent Series Inductance) | |
|
|
|
M/A-Com Technology Solutions |
800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 100PF 10% 50V SMD
|
Tray - Waffle | 90 | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | ±10% | 0.040" L x 0.040" W (1.02mm x 1.02mm) | 100pF | - | 50V | - | ||
|
|
|
IPDiA |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.022UF 15% 50V 0504
|
Tape & Reel (TR) | WBSC | Vertical Silicon Cap | -55°C ~ 150°C | 0504 (1210 Metric) | High Reliability，Low Profile | ±15% | 0.054" L x 0.039" W (1.37mm x 1.00mm) | 0.022μF | 100 mOhms | 50V | 100pH | ||
|
|
|
IPDiA |
595
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.022UF 15% 50V 0504
|
Cut Tape (CT) | WBSC | Vertical Silicon Cap | -55°C ~ 150°C | 0504 (1210 Metric) | High Reliability，Low Profile | ±15% | 0.054" L x 0.039" W (1.37mm x 1.00mm) | 0.022μF | 100 mOhms | 50V | 100pH | ||
|
|
|
IPDiA |
339
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 1.0UF 15% 11V 1208
|
Cut Tape (CT) | ETSC | Wirebond and Embedded | -55°C ~ 200°C | 1208 (3020 Metric) | High Reliability，Low Profile | ±15% | 0.118" L x 0.079" W (3.00mm x 2.00mm) | 1μF | 100 mOhms | 11V | 100pH | ||
|
|
|
IPDiA |
193
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 1.0UF 15% 11V 1208
|
Cut Tape (CT) | EXSC | High Temperature | -55°C ~ 250°C | 1208 (3020 Metric) | High Reliability，Low Profile | ±15% | 0.118" L x 0.079" W (3.00mm x 2.00mm) | 1μF | 100 mOhms | 11V | 100pH | ||
|
|
|
IPDiA |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.22UF 15% 11V 0505
|
Tape & Reel (TR) | EXSC | High Temperature | -55°C ~ 250°C | 0505 (1313 Metric) | High Reliability，Low Profile | ±15% | 0.049" L x 0.049" W (1.25mm x 1.25mm) | 0.22μF | 100 mOhms | 11V | 100pH | ||
|
|
|
IPDiA |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.22UF 15% 11V 0505
|
Cut Tape (CT) | EXSC | High Temperature | -55°C ~ 250°C | 0505 (1313 Metric) | High Reliability，Low Profile | ±15% | 0.049" L x 0.049" W (1.25mm x 1.25mm) | 0.22μF | 100 mOhms | 11V | 100pH | ||
|
|
|
IPDiA |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.1UF 15% 11V 0404
|
Cut Tape (CT) | ETSC | Wirebond and Embedded | -55°C ~ 200°C | 0404 (1010 Metric) | High Reliability，Low Profile | ±15% | 0.039" L x 0.039" W (1.00mm x 1.00mm) | 0.1μF | 100 mOhms | 11V | 100pH | ||
|
|
|
IPDiA |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 3.3UF 15% 11V 1616
|
Cut Tape (CT) | ETSC | Wirebond and Embedded | -55°C ~ 200°C | 1616 (4040 Metric) | High Reliability，Low Profile | ±15% | 0.157" L x 0.157" W (4.00mm x 4.00mm) | 3.3μF | 100 mOhms | 11V | 100pH | ||
|
|
|
IPDiA |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.1UF 15% 11V 0404
|
Cut Tape (CT) | EXSC | High Temperature | -55°C ~ 250°C | 0404 (1010 Metric) | High Reliability，Low Profile | ±15% | 0.039" L x 0.039" W (1.00mm x 1.00mm) | 0.1μF | 100 mOhms | 11V | 100pH |
