- Operating Temperature：
-
- Mounting Type：
-
- Termination：
-
- Contact Finish：
-
- Contact Finish Thickness：
-
- Contact Material：
-
- Contact Type：
-
- Electus conditionibus;
Odonata Lepidoptera products 54
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Termination | Contact Finish | Contact Finish Thickness | Pitch | Contact Material | Contact Type | Card Thickness | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Termination | Contact Finish | Contact Finish Thickness | Pitch | Contact Material | Contact Type | Card Thickness | |
|
|
|
Samtec Inc. |
2,948
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tube | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Amphenol FCI |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.039
|
Tape & Reel (TR) | - | - | Surface Mount，Right Angle | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
1,367
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.039
|
Cut Tape (CT) | - | - | Surface Mount，Right Angle | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
1,367
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.039
|
- | - | - | Surface Mount，Right Angle | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
3M |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | SPD08 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | Cantilever | 0.062" (1.57mm) | ||
|
|
|
3M |
368
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Cut Tape (CT) | SPD08 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | Cantilever | 0.062" (1.57mm) | ||
|
|
|
3M |
368
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
- | SPD08 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
33
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.635MM RIGHT ANGLE EDGE CARD ASS
|
Tray | MEC6 - DV | -55°C ~ 125°C | Surface Mount | Solder | Gold | 10.0μin (0.25μm) | 0.025" (0.64mm) | Phosphor Bronze | - | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
65
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8MM HIGH SPEED DUAL R/A MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount，Right Angle | Solder | Gold | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.635MM RIGHT ANGLE EDGE CARD ASS
|
Tray | MEC6 - RA | -55°C ~ 125°C | Surface Mount，Right Angle | Solder | Gold | 10.0μin (0.25μm) | 0.025" (0.64mm) | Phosphor Bronze | - | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
25
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.635MM RIGHT ANGLE EDGE CARD ASS
|
Tray | MEC6 - RA | -55°C ~ 125°C | Surface Mount，Right Angle | Solder | Gold | 30.0μin (0.76μm) | 0.025" (0.64mm) | Phosphor Bronze | - | 0.062" (1.57mm) | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | - | -40°C ~ 85°C | Surface Mount，Right Angle | Solder | Gold | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS .031
|
Tape & Reel (TR) | HPCE | - | Surface Mount，Right Angle | Solder | Gold or Gold，GXT | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS .031
|
Tape & Reel (TR) | - | - | Surface Mount，Right Angle | Solder | Gold or Gold，GXT | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS .031
|
Tape & Reel (TR) | - | -40°C ~ 85°C | Surface Mount，Right Angle | Solder | Gold or Gold，GXT | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | HPCE | - | Surface Mount，Right Angle | Solder | Gold | 15.0μin (0.38μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | - | -40°C ~ 85°C | Surface Mount，Right Angle | Solder | Gold | 15.0μin (0.38μm) | 0.031" (0.80mm) | Copper Alloy | - | 0.039" (1.00mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.063" (1.60mm) | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 20POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Solder | Gold | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) |
