- Packaging：
-
- Mounting Type：
-
- Features：
-
- Contact Finish Thickness：
-
- Pitch：
-
- Contact Material：
-
- Contact Type：
-
- Electus conditionibus;
Odonata Lepidoptera products 99
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Mounting Type | Features | Contact Finish Thickness | Pitch | Contact Material | Contact Type | Card Thickness | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Mounting Type | Features | Contact Finish Thickness | Pitch | Contact Material | Contact Type | Card Thickness | |
|
|
|
Samtec Inc. |
860
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tube | Edge Rate HSEC8 | Surface Mount | Board Guide | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
538
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | Surface Mount | Board Guide，Locking Ramp | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
361
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | Surface Mount | Board Guide | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | - | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
112
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | Surface Mount | Board Guide，Locking Ramp | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
172
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8MM HIGH SPEED DUAL R/A MO
|
Tray | Edge Rate HSEC8 | Surface Mount，Right Angle | Board Guide | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
281
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.635MM RIGHT ANGLE EDGE CARD ASS
|
Tray | MEC6 - RA | Surface Mount，Right Angle | Board Guide | 30.0μin (0.76μm) | 0.025" (0.64mm) | Phosphor Bronze | - | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
62
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MECF .050 EDGE CARD ASSEMBLY
|
Tube | MECF | Surface Mount | Board Guide | 10.0μin (0.25μm) | 0.050" (1.27mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | ||
|
|
|
Samtec Inc. |
30
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MECF .050 EDGE CARD ASSEMBLY
|
Tube | MECF | Surface Mount | Board Guide | 10.0μin (0.25μm) | 0.050" (1.27mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | ||
|
|
|
Samtec Inc. |
71
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.635MM RIGHT ANGLE EDGE CARD ASS
|
Tray | MEC6 - RA | Surface Mount，Right Angle | Board Guide | 10.0μin (0.25μm) | 0.025" (0.64mm) | Phosphor Bronze | - | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
97
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tube | Edge Rate HSEC8 | Board Edge，Straddle Mount | - | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide，Locking Ramp | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide，Locking Ramp | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.063" (1.60mm) | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.063" (1.60mm) | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tray | Edge Rate HSEC8 | Surface Mount | Board Guide | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.093" (2.36mm) | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide，Locking Ramp | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 40POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | Surface Mount | Board Guide，Solder Retention | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Cantilever | 0.063" (1.60mm) |
