- Packaging：
-
- Series：
-
- Operating Temperature：
-
- Mounting Type：
-
- Features：
-
- Color：
-
- Termination：
-
- Contact Finish Thickness：
-
- Contact Material：
-
- Contact Type：
-
- Electus conditionibus;
Odonata Lepidoptera products 379
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Color | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Flange Feature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Color | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Flange Feature | |
|
|
|
Samtec Inc. |
127
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Locking Ramp | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.062" (1.57mm) | - | ||
|
|
|
Samtec Inc. |
124
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Locking Ramp | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.062" (1.57mm) | - | ||
|
|
|
Molex，LLC |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | EdgeLine 170673 | -40°C ~ 105°C | Through Hole | - | Black | Press-Fit | 30.0μin (0.76μm) | 0.031" (0.80mm) | Copper Alloy | Non Specified - Dual Edge | - | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
50
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Locking Ramp | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.062" (1.57mm) | - | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Black | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 200POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Black | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - |
