- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
-
- Features：
-
- Termination：
-
- Contact Finish Thickness：
-
- Contact Material：
-
- Contact Type：
-
- Flange Feature：
-
- Electus conditionibus;
Odonata Lepidoptera products 348
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Flange Feature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Contact Finish Thickness | Pitch | Contact Material | Card Type | Contact Type | Card Thickness | Flange Feature | |
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.8MM HS DUAL VERT MNT EDGE ASSY
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Locking Ramp | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.062" (1.57mm) | - | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.093" (2.36mm) | - | |||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Board Lock | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Board Lock | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | - | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Solder Retention | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Board Lock | Solder | 10.0μin (0.25μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 180POS .031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide，Board Lock | Solder | 30.0μin (0.76μm) | 0.031" (0.80mm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 0.063" (1.60mm) | - |
