- Operating Temperature：
-
- Mounting Type：
-
- Features：
-
- Contact Finish Thickness：
-
- Contact Material：
-
- Card Thickness：
-
- Electus conditionibus;
Odonata Lepidoptera products 12
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Number of Positions | Contact Finish Thickness | Contact Material | Card Thickness | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Number of Positions | Contact Finish Thickness | Contact Material | Card Thickness | |
|
|
|
Samtec Inc. |
265
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | 80 | 30.0μin (0.76μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
215
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | 40 | 10.0μin (0.25μm) | Beryllium Copper | 0.062" (1.57mm) | ||
|
|
|
Samtec Inc. |
45
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8MM HIGH SPEED DUAL R/A MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount，Right Angle | - | 80 | 10.0μin (0.25μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | 60 | 30.0μin (0.76μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
16
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount | Board Guide | 120 | 30.0μin (0.76μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
20
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8MM HIGH SPEED DUAL R/A MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount，Right Angle | Latches | 26 | 10.0μin (0.25μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
21
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Edge，Straddle Mount | - | 80 | 10.0μin (0.25μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
15
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
8MM HIGH SPEED DUAL R/A MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Surface Mount，Right Angle | - | 120 | 30.0μin (0.76μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Samtec Inc. |
13
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.8MM HIGH SPEED DUAL VERTICAL MO
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Edge，Straddle Mount | - | 120 | 10.0μin (0.25μm) | Beryllium Copper | 0.063" (1.60mm) | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 11POS
|
Bulk | EdgeLine 151214 | -40°C ~ 105°C | Through Hole | Board Guide | 118 | 30.0μin (0.76μm) | Copper Alloy | 0.062" (1.57mm) | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONNECTOR ASSEMBLY
|
Bulk | EdgeLine 151214 | -40°C ~ 105°C | Through Hole | Board Guide | 174 | 30.0μin (0.76μm) | Copper Alloy | 0.062" (1.57mm) | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONNECTOR ASSEMBLY
|
Bulk | EdgeLine 151214 | -40°C ~ 105°C | Through Hole | Board Guide | 174 | 30.0μin (0.76μm) | Copper Alloy | 0.062" (1.57mm) |
