- Series:
-
- Operating Temperature:
-
- Features:
-
- Number of Positions:
-
- Contact Finish:
-
- Contact Finish Thickness:
-
- Contact Material:
-
- Card Type:
-
- Contact Type:
-
- Number of Positions/Bay/Row:
-
- Electus conditionibus;
Odonata Lepidoptera products 48
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Features | Number of Positions | Contact Finish | Contact Finish Thickness | Contact Material | Card Type | Contact Type | Number of Positions/Bay/Row | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Features | Number of Positions | Contact Finish | Contact Finish Thickness | Contact Material | Card Type | Contact Type | Number of Positions/Bay/Row | ||
Amphenol Commercial Products |
180
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 20POS 0.031 GOLD
|
Tape & Reel (TR) | COOL EDGE | - | Board Lock,Latches | 20 (18 + 2 Power) | Gold | - | Copper Alloy | - | Signal and Power | - | ||||
Amphenol Commercial Products |
355
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 20POS 0.031 GOLD
|
Cut Tape (CT) | COOL EDGE | - | Board Lock,Latches | 20 (18 + 2 Power) | Gold | - | Copper Alloy | - | Signal and Power | - | ||||
Amphenol Commercial Products |
355
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 20POS 0.031 GOLD
|
- | COOL EDGE | - | Board Lock,Latches | 20 (18 + 2 Power) | Gold | - | Copper Alloy | - | Signal and Power | - | ||||
Amphenol Commercial Products |
180
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 20POS 0.031
|
Tape & Reel (TR) | COOL EDGE | - | Board Guide,Latches | 20 (18 + 2 Power) | Gold or Gold-Palladium | 30.0μin (0.76μm) | Copper Alloy | - | - | - | ||||
Amphenol Commercial Products |
329
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 20POS 0.031
|
Cut Tape (CT) | COOL EDGE | - | Board Guide,Latches | 20 (18 + 2 Power) | Gold or Gold-Palladium | 30.0μin (0.76μm) | Copper Alloy | - | - | - | ||||
Amphenol Commercial Products |
329
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FEMALE 20POS 0.031
|
- | COOL EDGE | - | Board Guide,Latches | 20 (18 + 2 Power) | Gold or Gold-Palladium | 30.0μin (0.76μm) | Copper Alloy | - | - | - | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 42 (40 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 42 (40 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 62POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 62 (60 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 30; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide,Solder Retention | 42 (40 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 62POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide,Solder Retention | 62 (60 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 30; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide,Solder Retention | 42 (40 + 2 Power) | Gold | 30.0μin (0.76μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide,Solder Retention | 42 (40 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 82POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 82 (80 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 40; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 42 (40 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 42 (40 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 62POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 62 (60 + 2 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 30; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 42POS 0.031
|
Tray | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 42 (40 + 2 Power) | Gold | 30.0μin (0.76μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 82POS 0.031
|
Tape & Reel (TR) | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 82 (80 + 2 Power) | Gold | 30.0μin (0.76μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 40; 2 | ||||
Samtec Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN EDGE DUAL FMALE 44POS 0.031
|
Bulk | Edge Rate HSEC8 | -55°C ~ 125°C | Board Guide | 44 (40 + 4 Power) | Gold | 10.0μin (0.25μm) | Beryllium Copper | Non Specified - Dual Edge | Cantilever | 20; 2; 2 |