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Odonata Lepidoptera products 607
Image part manufacturer quantitas partus tempus Unit Price buy Description Packaging Series Operating Temperature Mounting Type Color Termination Number of Positions Contact Finish Contact Finish Thickness Pitch Contact Material Card Type Contact Type Card Thickness Number of Positions/Bay/Row
10018783-10203TLF
Amphenol FCI
5,743
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Solder,Staggered 164 Gold Flash 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
NWE18DHHN-T931
Sullins Connector Solutions
2,792
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 36POS 0.039
Tray - -55°C ~ 85°C Through Hole Black Solder,Staggered 36 Gold Flash 0.039" (1.00mm) Phosphor Bronze PCI Express Cantilever 0.062" (1.57mm) 18
10018783-10002MLF
Amphenol FCI
5,275
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 98POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Solder,Staggered 98 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
877159106
Molex,LLC
3,294
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 64POS 0.039
Tray 87715 -55°C ~ 85°C Through Hole Black Solder,Staggered 64 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Phosphor Bronze PCI Express - 0.062" (1.57mm) -
10018783-10003TLF
Amphenol FCI
2,975
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Solder,Staggered 164 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
10061913-100CLF
Amphenol FCI
6,149
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 36POS 0.039
Tray HPCE -55°C ~ 85°C Surface Mount Black Solder 36 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
877159205
Molex,LLC
1,414
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 98POS 0.039
Tray 87715 -55°C ~ 85°C Through Hole Black Solder 98 Gold 15.0μin (0.38μm) 0.039" (1.00mm) Phosphor Bronze PCI Express - 0.062" (1.57mm) -
10061913-101CLF
Amphenol FCI
4,923
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 64POS 0.039
Tray HPCE -55°C ~ 85°C Surface Mount Black Solder 64 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) 11; 21
1-1871058-3
TE Connectivity AMP Connectors
215
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 98POS 0.039
Bulk - -55°C ~ 85°C Through Hole Black Press-Fit 98 Gold or Gold-Palladium 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express - 0.062" (1.57mm) -
7-1734774-3
TE Connectivity AMP Connectors
5,995
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray - - Through Hole Black Solder,Staggered 164 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Phosphor Bronze - Tin Plated PCI Express Cantilever 0.062" (1.57mm) -
10061913-103CLF
Amphenol FCI
2,712
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray HPCE -55°C ~ 85°C Surface Mount Black Solder 164 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
10061913-102CLF
Amphenol FCI
4,506
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 98POS 0.039
Tray HPCE -55°C ~ 85°C Surface Mount Black Solder 98 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
1871058-1
TE Connectivity AMP Connectors
954
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 36POS 0.039
Tray - -55°C ~ 85°C Through Hole Black Press-Fit 36 Gold-Palladium 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express - 0.062" (1.57mm) -
10039755-10003TLF
Amphenol FCI
176
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Press-Fit 164 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
877159305
Molex,LLC
2,887
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray 87715 -55°C ~ 85°C Through Hole Black Solder,Staggered 164 Gold 15.0μin (0.38μm) 0.039" (1.00mm) Phosphor Bronze PCI Express - 0.062" (1.57mm) -
10061913-103TLF
Amphenol FCI
3,497
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray HPCE -55°C ~ 85°C Surface Mount Black Solder 164 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
10082378-11003TLF
Amphenol FCI
8,128
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 164POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Press-Fit 164 Gold 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express - 0.062" (1.57mm) -
1871058-4
TE Connectivity AMP Connectors
1,155
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FMALE 164POS 0.039
Bulk - -55°C ~ 85°C Through Hole Black Press-Fit 164 Gold-Palladium 30.0μin (0.76μm) 0.039" (1.00mm) Copper Alloy PCI Express - 0.062" (1.57mm) -
10018784-10200TLF
Amphenol FCI
14,379
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 36POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Solder,Staggered 36 Gold Flash 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -
10018783-10200TLF
Amphenol FCI
4,802
III dies
-
MOQ: 1  MPQ: 1
CONN PCI EXP FEMALE 36POS 0.039
Tray HPCE -55°C ~ 85°C Through Hole Black Solder,Staggered 36 Gold Flash 0.039" (1.00mm) Copper Alloy PCI Express Cantilever 0.062" (1.57mm) -