- Series：
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- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Height Above Board：
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- Material Flammability Rating：
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- Contact Finish：
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- Contact Material：
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- Housing Material：
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- Connector/Contact Type：
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- FFC，FCB Thickness：
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- Locking Feature：
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- Cable End Type：
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- Actuator Material：
-
- Electus conditionibus;
Odonata Lepidoptera products 112
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Height Above Board | Material Flammability Rating | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
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TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Cut Tape (CT) | - | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.039" (1.00mm) | - | Gold | 50V | Copper Alloy | Thermoplastic | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Thermoplastic | ||
|
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
- | - | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.039" (1.00mm) | - | Gold | 50V | Copper Alloy | Thermoplastic | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Thermoplastic | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 27POS 0.30MM R/A
|
Tape & Reel (TR) | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 27POS 0.30MM R/A
|
Cut Tape (CT) | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC 27POS 0.30MM R/A
|
- | BackFlip，Easy-On 502598 | -40°C ~ 85°C | Surface Mount，Right Angle | Solder Retention | Solder | 0.045" (1.14mm) | UL94 V-0，UL94 HB | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Top and Bottom | 0.20mm | Flip Lock，Backlock | Tapered | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
JAE Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Tape & Reel (TR) | FB10 | -40°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | - | Gold | 50V | Phosphor Bronze | Plastic | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed or Tapered | Plastic | ||
|
|
|
JAE Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Cut Tape (CT) | FB10 | -40°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | - | Gold | 50V | Phosphor Bronze | Plastic | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed or Tapered | Plastic | ||
|
|
|
JAE Electronics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
- | FB10 | -40°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | - | Gold | 50V | Phosphor Bronze | Plastic | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tabbed or Tapered | Plastic | ||
|
|
Hirose Electric Co Ltd |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Tape & Reel (TR) | FH23 | -55°C ~ 85°C | Surface Mount，Right Angle | Low ion Force (LIF) | Solder | 0.049" (1.25mm) | UL94 V-0 | Gold | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Halogen Free | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Liquid Crystal Polymer (LCP)，Halogen Free | |||
|
|
Hirose Electric Co Ltd |
10,323
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Cut Tape (CT) | FH23 | -55°C ~ 85°C | Surface Mount，Right Angle | Low ion Force (LIF) | Solder | 0.049" (1.25mm) | UL94 V-0 | Gold | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Halogen Free | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Liquid Crystal Polymer (LCP)，Halogen Free | |||
|
|
Hirose Electric Co Ltd |
10,323
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
- | FH23 | -55°C ~ 85°C | Surface Mount，Right Angle | Low ion Force (LIF) | Solder | 0.049" (1.25mm) | UL94 V-0 | Gold | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP)，Halogen Free | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Liquid Crystal Polymer (LCP)，Halogen Free | |||
|
|
Hirose Electric Co Ltd |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Tape & Reel (TR) | FH26 | -55°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.039" (1.00mm) | UL94 V-0 | Gold | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polyamide (PA)，Nylon | |||
|
|
Hirose Electric Co Ltd |
13,107
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Cut Tape (CT) | FH26 | -55°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.039" (1.00mm) | UL94 V-0 | Gold | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polyamide (PA)，Nylon | |||
|
|
Hirose Electric Co Ltd |
13,107
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
- | FH26 | -55°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.039" (1.00mm) | UL94 V-0 | Gold | 30V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polyamide (PA)，Nylon | |||
|
|
TE Connectivity AMP Connectors |
12,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.3FPC NARROW BF
|
Tape & Reel (TR) | - | -20°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | - | Gold | 50V | Copper Alloy | Thermoplastic | FPC | Contacts，Top | 0.20mm | Flip Lock，Backlock | Tapered | Thermoplastic | |||
|
|
TE Connectivity AMP Connectors |
14,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.3FPC NARROW BF
|
Cut Tape (CT) | - | -20°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Thermoplastic | FPC | Contacts，Top | 0.20mm | Flip Lock，Backlock | Tapered | Thermoplastic | |||
|
|
TE Connectivity AMP Connectors |
14,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.3FPC NARROW BF
|
- | - | -20°C ~ 85°C | Surface Mount，Right Angle | Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Thermoplastic | FPC | Contacts，Top | 0.20mm | Flip Lock，Backlock | Tapered | Thermoplastic | |||
|
|
TE Connectivity AMP Connectors |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.3FPC NARROW BF
|
Tape & Reel (TR) | - | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polyphenylene Sulfide (PPS)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
7,807
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.3FPC NARROW BF
|
Cut Tape (CT) | - | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polyphenylene Sulfide (PPS)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
7,807
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.3FPC NARROW BF
|
- | - | -25°C ~ 85°C | Surface Mount，Right Angle | Solder Retention，Zero ion Force (ZIF) | Solder | 0.047" (1.20mm) | UL94 V-0 | Gold | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | Tapered | Polyphenylene Sulfide (PPS)，Glass Filled |
