- Packaging：
-
- Series：
-
- Operating Temperature：
-
- Height Above Board：
-
- Material Flammability Rating：
-
- Locking Feature：
-
Odonata Lepidoptera products 19
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Material Flammability Rating | Number of Positions | Locking Feature | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Material Flammability Rating | Number of Positions | Locking Feature | Actuator Material | |
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 25POS 0.25MM R/A
|
Tape & Reel (TR) | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 25 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 25POS 0.25MM R/A
|
Cut Tape (CT) | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 25 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 25POS 0.25MM R/A
|
- | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 25 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 37POS 0.25MM R/A
|
Tape & Reel (TR) | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 37 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 41POS 0.25MM R/A
|
Tape & Reel (TR) | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 41 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 41POS 0.25MM R/A
|
Cut Tape (CT) | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 41 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 41POS 0.25MM R/A
|
- | Easy-On 503320 | -40°C ~ 85°C | Solder Retention | - | UL94 V-0，UL94 HB | 41 | Flip Lock | Polyamide (PA)，Nylon，Glass Filled | ||
|
|
TE Connectivity AMP Connectors |
17,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
Tape & Reel (TR) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 37 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
20,605
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
Cut Tape (CT) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 37 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
20,605
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
- | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 37 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
10,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
Tape & Reel (TR) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 51 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
12,294
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
Cut Tape (CT) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 51 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
12,294
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
- | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 51 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 41POS 0.25MM R/A
|
Tape & Reel (TR) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 41 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
1,591
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 41POS 0.25MM R/A
|
Cut Tape (CT) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 41 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
1,591
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 41POS 0.25MM R/A
|
- | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 41 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.3
|
Tape & Reel (TR) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 45 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
5,903
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.4
|
Cut Tape (CT) | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 45 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled | |||
|
|
TE Connectivity AMP Connectors |
5,903
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMBOSS TAPING 0.25FPC BF-L-1.4
|
- | - | -25°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 45 | Slide Lock | Liquid Crystal Polymer (LCP)，Glass Filled |
