- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Size / Dimension：
-
- Frequency Stability：
-
- Programmable Type：
-
- Frequency Stability (Total)：
-
- Electus conditionibus;
Odonata Lepidoptera products 53
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Size / Dimension | Frequency Stability | Programmable Type | Frequency Stability (Total) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Size / Dimension | Frequency Stability | Programmable Type | Frequency Stability (Total) | |
|
|
|
Microchip Technology |
375
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
108
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
575
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | Blank (User Must Program) | ±50ppm | ||
|
|
|
Microchip Technology |
151
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 25PPM 4VDFN
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | ±25ppm | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
183
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
87
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
418
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | Blank (User Must Program) | ±50ppm | ||
|
|
|
Microchip Technology |
817
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
382
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | Blank (User Must Program) | ±50ppm | ||
|
|
|
Microchip Technology |
770
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
495
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC PGM 1MHZ - 150MHZ SMD
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead Exposed Pad | 0.197" L x 0.126" W (5.00mm x 3.20mm) | ±25ppm | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | -40°C ~ 85°C | 4-SMD，No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
53
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | -40°C ~ 105°C | 4-SMD，No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK CMOS
|
Tape & Reel (TR) | -40°C ~ 85°C | 4-SMD，No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | ±25ppm | Blank (User Must Program) | - |
