- Function：
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- Operating Temperature：
-
- Package / Case：
-
- Output：
-
- Size / Dimension：
-
- Ratings：
-
- Frequency Stability：
-
- Programmable Type：
-
- Frequency Stability (Total)：
-
- Electus conditionibus;
Odonata Lepidoptera products 104
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Function | Operating Temperature | Package / Case | Output | Type | Size / Dimension | Ratings | Frequency Stability | Current - Supply (Max) | Programmable Type | Frequency Stability (Total) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Function | Operating Temperature | Package / Case | Output | Type | Size / Dimension | Ratings | Frequency Stability | Current - Supply (Max) | Programmable Type | Frequency Stability (Total) | |
|
|
|
Microchip Technology |
875
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 25PPM 6VDFN
|
Tube | DSC8124 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | ±25ppm | 42mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
845
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Tube | DSC8124 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | ±10ppm | 42mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 LVDS
|
Tube | DSC8123 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
840
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 25PPM 6VDFN
|
Tube | DSC8102 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±25ppm | 58mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
101
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 LVDS
|
Tube | DSC8123 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
106
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 LVDS
|
Tube | DSC8103 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | - | 32mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
660
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Tube | DSC8123 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
414
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 HCSL
|
Tube | DSC8124 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | XO (Standard) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | - | 42mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
430
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 HCSL
|
Tube | DSC8104 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | - | 42mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
440
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 HCSL
|
Tube | DSC8104 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | - | 42mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
432
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC PROGRAMMABLE HCSL
|
Tube | DSC8124 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | ±25ppm | 42mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC PGM 10MHZ - 460MHZ SMD
|
Tube | DSC8124 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead Exposed Pad | HCSL | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | ±25ppm | 42mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
440
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 HCSL
|
Tube | DSC8104 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | HCSL | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | - | 42mA | Blank (User Must Program) | ±10ppm | ||
|
|
|
Microchip Technology |
245
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK
|
Tube | DSC8103 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | ±25ppm | 32mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Tape & Reel (TR) | DSC8123 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
Cut Tape (CT) | DSC8123 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 10PPM 6VDFN
|
- | DSC8123 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVDS | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | - | ±10ppm | 32mA | Blank (User Must Program) | - | ||
|
|
|
Microchip Technology |
280
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 LVPECL
|
Tube | DSC8122 | Enable/Disable | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | - | 58mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
216
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | DSC8102 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | - | 58mA | Blank (User Must Program) | ±25ppm | ||
|
|
|
Microchip Technology |
200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | DSC8102 | Standby | -40°C ~ 85°C | 6-SMD，No Lead | LVPECL | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | - | 58mA | Blank (User Must Program) | ±25ppm |
