- Contents：
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- Utilized IC / Part：
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- Electus conditionibus;
Odonata Lepidoptera products 26
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Contents | Utilized IC / Part | Platform | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Contents | Utilized IC / Part | Platform | |
|
|
|
MikroElektronika |
12
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD IR THERMO CLICK 5.0V
|
Board(s) | MLX90614 | mikroBUS Click | ||
|
|
|
DFRobot |
27
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GRAVITY: DS18B20 TEMPERATURE SEN
|
Board(s)，Cable(s) | DS18B20 | Gravity | ||
|
|
|
DFRobot |
34
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GRAVITY:ANALOG LM35 LINEAR TEMPE
|
Board(s)，Cable(s) | LM35 | Gravity | ||
|
|
|
DFRobot |
19
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GRAVITY: ANALOG HIGH TEMPERATURE
|
Board(s)，Cable(s) | PT100 | Gravity | ||
|
|
|
MikroElektronika |
10
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMOSTAT CLICK
|
Board(s) | MAX7502 | mikroBUS Click | ||
|
|
|
MikroElektronika |
10
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RTD CLICK
|
Board(s) | MAX31865 | mikroBUS Click | ||
|
|
|
MikroElektronika |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMO K CLICK
|
Board(s) | MCP9600 | mikroBUS Click | ||
|
|
|
MikroElektronika |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMO J CLICK
|
Board(s) | MCP9600 | mikroBUS Click | ||
|
|
|
MikroElektronika |
6
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEV BOARD THERMO 3 CLICK
|
Board(s) | TMP102 | mikroBUS Click | ||
|
|
|
MikroElektronika |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEV BOARD THERMO 2 CLICK
|
Board(s) | DS1825 | mikroBUS Click | ||
|
|
|
MikroElektronika |
5
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FEVER CLICK
|
Board(s) | MAX30205 | mikroBUS Click | ||
|
|
|
Seeed Technology Co.，Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ONE WIRE TEMPERATURE SENSOR
|
Sensor | DS18B20 | Grove | ||
|
|
|
MikroElektronika |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD IR THERMO CLICK 3.3V
|
Board(s) | MLX90614 | mikroBUS Click | ||
|
|
|
Seeed Technology Co.，Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RASPBERRY TEMP SENSOR
|
Board(s) | LM75 | Raspberry Pi | ||
|
|
Seeed Technology Co.，Ltd |
38
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GROVE TEMPERATURE SENSOR
|
Board(s)，Cable(s) | LM358，NCP18WF104 | Grove | |||
|
|
TE Connectivity Measurement Specialties |
96
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GROVE TSYS02D DEV BOARD
|
Board(s) | TSYS02D | Grove | |||
|
|
TE Connectivity Measurement Specialties |
90
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PMOD TSYS01
|
Board(s) | TSYS01 | Pmod | |||
|
|
TE Connectivity Measurement Specialties |
100
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
XPLAINED PRO TSYS01
|
Board(s) | TSYS01 | Xplained Pro | |||
|
|
TE Connectivity Measurement Specialties |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
XPLAINED PRO TSYS02D
|
Board(s) | TSYS02D | Xplained Pro | |||
|
|
Seeed Technology Co.，Ltd |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GROVE HIGH TEMP SENSOR
|
Board(s) | - | Grove |
