- manufacturer：
-
- Series：
-
- Interface：
-
- Voltage - Supply：
-
- Sensitivity：
-
- Utilized IC / Part：
-
- Supplied Contents：
-
- Sensor Type：
-
- Sensing Range：
-
- Electus conditionibus;
Odonata Lepidoptera products 76
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Interface | Voltage - Supply | Sensitivity | Utilized IC / Part | Supplied Contents | Sensor Type | Sensing Range | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Interface | Voltage - Supply | Sensitivity | Utilized IC / Part | Supplied Contents | Sensor Type | Sensing Range | |
|
|
|
STMicroelectronics |
127
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EVAL BOARD FOR VL53L0X
|
- | I2C | - | - | STM32F401RE，VL53L0X，mbed-Enabled Development | Board(s) | Light，3D Time-of-Flight (ToF) | - | ||
|
|
|
STMicroelectronics |
189
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSORTILE DEV KIT
|
SensorTile | RF | 5V，USB | - | BlueNRG-MS，LPS22HB，LSM6DSM，LSM303AGR，MP34DT04，STM32L4 | Board(s)，Cable(s)，Accessories | Accelerometer，Gyroscope，Humidity，Magnetometer，Pressure，Temperature | - | ||
|
|
|
Maxim Integrated |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EVKIT HEALTH SENSOR PLATFORM
|
- | USB | - | - | MAX30003，MAX30101，MAX30205，MAX32620 | Board(s)，Cable(s) | Medical，Health and Fitness | - | ||
|
|
|
Bosch Connected Devices and Solutions |
428
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
XDK SENSOR-BASED DEVELOPMENT KIT
|
- | RF | - | - | AKU340，BMA280，BME280，BMG160，BMI160，BMM150，MAX44009 | Board(s)，Cable(s) | Accelerometer，Gyroscope，Humidity，Magnetometer，Pressure，Temperature | - | ||
|
|
|
XSens Technologies BV |
51
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEV KIT FOR MTI 1 SERIES
|
MTi 1 | Serial | 2.16 V ~ 3.45 V | - | MTi 1-Series | Board(s)，Cable(s) | Accelerometer，Gyroscope，Magnetometer | - | ||
|
|
|
Silicon Labs |
369
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EVAL BOARD OPTICAL RH TEMP BLE
|
- | RF | - | - | Si1147，Si7013 | Board(s) | Humidity，Optical，Temperature | - | ||
|
|
|
Adafruit Industries LLC |
576
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BREAKOUT BOARD 9-DOF IMU BNO055
|
- | - | - | - | BNO055 | Board(s) | Accelerometer，Gyroscope，Magnetometer，3 Axis | - | ||
|
|
|
STMicroelectronics |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSORTILE CONNECTABLE NODE
|
SensorTile | RF | 2 V ~ 5.5 V | - | BlueNRG-MS，LPS22HB，LSM6DSM，LSM303AGR，MP34DT04，STM32L4 | Board(s) | Accelerometer，Gyroscope，Humidity，Magnetometer，Pressure，Temperature | - | ||
|
|
|
STMicroelectronics |
241
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WEARABLE SENSOR UNIT REF DESIGN
|
- | RF | - | - | LIS3MDL，LPS25HB，LSM6DS3 | Board(s)，Cable(s)，Accessories | Accelerometer，Gyroscope，Magnetometer，Pressure | - | ||
|
|
|
TDK InvenSense |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEVELOPMENT BOARD FOR ICM-20948
|
- | I2C，SPI | 5V，USB | - | ICM-20948 | Board(s) | Accelerometer，Gyroscope，Magnetometer，3 Axis | ±2g，4g，8g，16g，±250°/sec，±500°/sec，±1000°/sec，±2000°/sec，±4900μT | ||
|
|
|
TDK InvenSense |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEVELOPMENT BOARD FOR ICM-20789
|
- | I2C，SPI | 5V，USB | - | ICM-20789 | Board(s) | Accelerometer，Gyroscope，Pressure | ±2g，4g，8g，16g，±250°/sec，±500°/sec，±1000°/sec，±2000°/sec | ||
|
|
|
STMicroelectronics |
49
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD DEV EMOTION WIN8
|
iNEMO | USB | - | - | L3GD20，LSM303DLHC | Board(s) | Accelerometer，Gyroscope，Magnetometer，3 Axis | - | ||
|
|
|
Microchip Technology |
82
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD EVAL PCAP FOR PIC32
|
PIC 32 | I2C | - | - | PIC32MX795F512 | Board(s) | Touch Screen | - | ||
|
|
|
TDK InvenSense |
42
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEVELOPMENT BOARD FOR ICM-20602
|
- | I2C，SPI | 5V，USB | - | ICM-20602 | Board(s) | Accelerometer，Gyroscope，3 Axis | ±2g，4g，8g，16g，±250°/sec，±500°/sec，±1000°/sec，±2000°/sec | ||
|
|
|
TDK InvenSense |
41
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DEVELOPMENT BOARD FOR ICM-20648
|
- | I2C，SPI | 5V，USB | - | ICM-20648 | Board(s) | Accelerometer，Gyroscope，3 Axis | ±2g，4g，8g，16g，±250°/sec，±500°/sec，±1000°/sec，±2000°/sec | ||
|
|
|
STMicroelectronics |
151
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSORTILE CONNECTABLE NODE
|
SensorTile | RF | 2 V ~ 5.5 V | - | BlueNRG-MS，LPS22HB，LSM6DSM，LSM303AGR，MP34DT04，STM32L4 | Board(s) | Accelerometer，Gyroscope，Humidity，Magnetometer，Pressure，Temperature | - | ||
|
|
|
Texas Instruments |
7
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EVAL NEAR-INFRARED SPECTROMETER
|
DLP NIRscan | - | - | - | DLP2010NIR | Board(s) | Light，Spectrometer | 900nm ~ 1700nm | ||
|
|
|
Bosch Sensortec |
17
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHUTTLE BOARD DEV KIT BNO055
|
- | I2C，SPI | 2.4 V ~ 3.6 V | - | BNO055 | Board(s) | Accelerometer，Gyroscope，Magnetometer，3 Axis | - | ||
|
|
|
Bosch Sensortec |
53
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BNO055 USB-STICK EVAL KIT
|
- | I2C，SPI | 2.4 V ~ 3.6 V | - | BNO055 | Board(s) | Accelerometer，Gyroscope，Magnetometer，3 Axis | - | ||
|
|
|
STMicroelectronics |
87
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD EXPANSION VL6180X
|
FlightSense | I2C | - | - | STM32F401RE，VL6180X，mbed-Enabled Development | Board(s) | Light，3D Time-of-Flight (ToF) | - |
