- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 25
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Wakefield-Vette |
385
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X12MM PIN
|
901 | 0.748" (19.00mm) | 0.748" (19.00mm) | Clip | BGA | 6.60°C/W @ 200 LFM | 12.70°C/W | ||
|
|
|
Wakefield-Vette |
823
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 27X27X12MM PIN
|
904 | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip | BGA | 4.30°C/W @ 200 LFM | 12.90°C/W | ||
|
|
|
CTS Thermal Management Products |
360
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | 1.047" (26.60mm) | 1.047" (26.60mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
|
|
|
Wakefield-Vette |
881
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12MM PIN
|
910 | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | BGA | 2.80°C/W @ 200 LFM | 9.20°C/W | ||
|
|
|
Wakefield-Vette |
335
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X12MM PIN
|
902 | 0.827" (21.00mm) | 0.827" (21.00mm) | Clip | BGA | 5.80°C/W @ 200 LFM | 14.30°C/W | ||
|
|
|
Wakefield-Vette |
191
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM PIN
|
908 | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 3.10°C/W @ 200 LFM | 11.10°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X12MM PIN
|
906 | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip | BGA | 3.40°C/W @ 200 LFM | 12.00°C/W | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | 1.283" (32.60mm) | 1.283" (32.60mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APR | 1.366" (34.70mm) | 1.366" (34.70mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.50°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 27 X 27 X 12MM
|
APR | 1.047" (26.60mm) | 1.047" (26.60mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH SMALL CLIP
|
APR | 1.047" (26.60mm) | 1.047" (26.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH MEDIUM CLIP
|
APR | 1.047" (26.60mm) | 1.047" (26.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH TALL CLIP
|
APR | 1.047" (26.60mm) | 1.047" (26.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 5.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 33 X 33 X 12MM
|
APR | 1.283" (32.60mm) | 1.283" (32.60mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH SMALL CLIP
|
APR | 1.283" (32.60mm) | 1.283" (32.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH MEDIUM CLIP
|
APR | 1.283" (32.60mm) | 1.283" (32.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH TALL CLIP
|
APR | 1.283" (32.60mm) | 1.283" (32.60mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.80°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 38 X 38 X 12MM
|
APR | 1.461" (37.10mm) | 1.461" (37.10mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - | ||
|
|
|
CTS Thermal Management Products |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED WITH SMALL CLIP
|
APR | 1.461" (37.10mm) | 1.461" (37.10mm) | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 3.30°C/W @ 200 LFM | - |
