- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,570
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 LOCKING TAB CLIP
|
Board Level | Aluminum | 0.800" (20.32mm) | 0.268" (6.81mm) | Clip | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | 23.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.20°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | - | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 1.5W @ 20°C | 3.00°C/W @ 700 LFM | 12.40°C/W | Tin |
