- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
1.500" (38.10mm) | TO-220 | 8.0W @ 40°C | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,729
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
1.500" (38.10mm) | TO-220 (Dual) | 10.0W @ 50°C | 3.00°C/W @ 200 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
1.000" (25.40mm) | TO-220 | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.70°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
2.000" (50.80mm) | TO-220 | 6.0W @ 30°C | 1.00°C/W @ 800 LFM | 4.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
2.000" (50.80mm) | TO-220 (Dual) | 6.0W @ 30°C | 1.00°C/W @ 800 LFM | 2.70°C/W |
