- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,120
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 W/PINS 1.5"TALL
|
1.500" (38.10mm) | Bolt On and PC Pin | TO-218 | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,729
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
1.500" (38.10mm) | Clip and PC Pin | TO-220 (Dual) | 3.00°C/W @ 200 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
135
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN 50.8MM
|
2.000" (50.80mm) | Bolt On and PC Pin | TO-220 | 2.00°C/W @ 300 LFM | 4.80°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
1.500" (38.10mm) | Bolt On and PC Pin | TO-220 | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUDED 25X41.6X38.1MM
|
1.500" (38.10mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.50°C/W @ 700 LFM | - |
