- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 4
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,710
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK 1" TO-220
|
Bolt On and PC Pin | TO-220 | 4.0W @ 30°C | 5.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 SOLDER PIN
|
Bolt On and PC Pin | TO-218 | 12.0W @ 70°C | 5.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Bolt On and PC Pin | TO-218 | 12.0W @ 70°C | 5.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Clip and PC Pin | TO-220 | 12.0W @ 70°C | 5.70°C/W |
