- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,729
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Clip and PC Pin | TO-220 (Dual) | 10.0W @ 50°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On | TO-218 | 5.0W @ 30°C | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218 | 5.0W @ 30°C | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 10.0W @ 50°C | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Square, Pin Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | Bolt On | TO-3 | 4.0W @ 30°C | 7.80°C/W |
