- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 14
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
- | Board Level, Vertical | Clip and PC Pin | TO-220 | 8.0W @ 40°C | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,040
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 10W H=1.5" BLK
|
- | Board Level, Vertical | Bolt On | TO-220 | 8.0W @ 40°C | 2.00°C/W @ 500 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,120
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218 W/PINS 1.5"TALL
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-218 | 10.0W @ 50°C | 2.00°C/W @ 500 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,729
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
- | Board Level, Vertical | Clip and PC Pin | TO-220 (Dual) | 10.0W @ 50°C | 3.00°C/W @ 200 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,820
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN 38.1MM
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-220 | 6.0W @ 40°C | 2.00°C/W @ 400 LFM | 5.50°C/W | ||
|
|
|
CTS Thermal Management Products |
667
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR W/PINS BLACK TO-220
|
7 | Board Level, Vertical | Bolt On and PC Pin | TO-220 | 6.0W @ 60°C | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 PIN BLACK
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-220 | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 4.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Bolt On | TO-218 | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Bolt On | TO-220 | 6.0W @ 40°C | 2.00°C/W @ 400 LFM | 5.50°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-218 | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-220 | 10.0W @ 50°C | 3.00°C/W @ 200 LFM | 5.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-220, TO-218 | 6.0W @ 50°C | 3.50°C/W @ 200 LFM | 5.80°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
647 | Board Level, Vertical | Bolt On and PC Pin | TO-220 | 6.0W @ 37°C | 3.50°C/W @ 200 LFM | - | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUDED 25X41.6X38.1MM
|
- | Board Level, Vertical | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 10.0W @ 50°C | 1.50°C/W @ 700 LFM | - |
