manufacturer:
Odonata Lepidoptera products 49
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Length Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
529702B02500G
Aavid, Thermal Division of Boyd Corporation
5,710
III dies
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK 1" TO-220
- Board Level, Vertical 1.000" (25.40mm) Bolt On and PC Pin TO-220 4.0W @ 30°C 4.00°C/W @ 200 LFM 5.50°C/W
6396BG
Aavid, Thermal Division of Boyd Corporation
1,969
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-218/TO-220 PIN
- Board Level, Vertical 1.000" (25.40mm) Bolt On and PC Pin TO-220, TO-218 4.0W @ 30°C 1.50°C/W @ 600 LFM 5.60°C/W
530002B02500G
Aavid, Thermal Division of Boyd Corporation
3,240
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 POWER W/PINS BK
- Board Level, Vertical 2.500" (63.50mm) Bolt On and PC Pin TO-220 20.0W @ 60°C 2.00°C/W @ 300 LFM 2.60°C/W
529902B02500G
Aavid, Thermal Division of Boyd Corporation
6,975
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS BLK 2"
- Board Level, Vertical 2.000" (50.80mm) Bolt On and PC Pin TO-220 6.0W @ 30°C 1.50°C/W @ 500 LFM 4.50°C/W
533402B02552G
Aavid, Thermal Division of Boyd Corporation
4,336
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SOLDERPIN/CLIP
- Board Level, Vertical 1.500" (38.10mm) Clip and PC Pin TO-220 8.0W @ 40°C 2.00°C/W @ 500 LFM 5.00°C/W
6400BG
Aavid, Thermal Division of Boyd Corporation
4,063
III dies
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical 2.500" (63.50mm) Bolt On and PC Pin TO-218, TO-220, TO-247, Multiwatt 4.0W @ 20°C 1.50°C/W @ 400 LFM 2.70°C/W
7-339-3PP-BA
CTS Thermal Management Products
2,562
III dies
-
MOQ: 1  MPQ: 1
HEATSINK PWR W/PINS BLACK TO-220
7 Board Level, Vertical 2.000" (50.80mm) Bolt On and PC Pin TO-220 6.0W @ 40°C - 7.00°C/W
529802B00000
Aavid, Thermal Division of Boyd Corporation
2,040
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 10W H=1.5" BLK
- Board Level, Vertical 1.500" (38.10mm) Bolt On TO-220 8.0W @ 40°C 2.00°C/W @ 500 LFM -
529801B02500G
Aavid, Thermal Division of Boyd Corporation
3,120
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-218 W/PINS 1.5"TALL
- Board Level, Vertical 1.500" (38.10mm) Bolt On and PC Pin TO-218 10.0W @ 50°C 2.00°C/W @ 500 LFM 5.00°C/W
529701B02500G
Aavid, Thermal Division of Boyd Corporation
4,500
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-218 SOLDER PIN
- Board Level, Vertical 1.000" (25.40mm) Bolt On and PC Pin TO-218 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W
529901B02500G
Aavid, Thermal Division of Boyd Corporation
3,101
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-218 SOLDER PIN
- Board Level, Vertical 2.000" (50.80mm) Bolt On and PC Pin TO-218 12.0W @ 50°C 1.00°C/W @ 800 LFM 4.50°C/W
530001B02500G
Aavid, Thermal Division of Boyd Corporation
4,000
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-218 10W H=2.5" BLK
- Board Level, Vertical 2.500" (63.50mm) Bolt On and PC Pin TO-218 20.0W @ 60°C 2.00°C/W @ 300 LFM 8.00°C/W
533422B02552G
Aavid, Thermal Division of Boyd Corporation
1,729
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SOLDERPIN/CLIP
- Board Level, Vertical 1.500" (38.10mm) Clip and PC Pin TO-220 (Dual) 10.0W @ 50°C 3.00°C/W @ 200 LFM -
532602B02500G
Aavid, Thermal Division of Boyd Corporation
1,820
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SOLDERPIN 38.1MM
- Board Level, Vertical 1.500" (38.10mm) Bolt On and PC Pin TO-220 6.0W @ 40°C 2.00°C/W @ 400 LFM 5.50°C/W
7-339-1PP-BA
CTS Thermal Management Products
667
III dies
-
MOQ: 1  MPQ: 1
HEATSINK PWR W/PINS BLACK TO-220
7 Board Level, Vertical 1.500" (38.10mm) Bolt On and PC Pin TO-220 6.0W @ 60°C - -
532702B02500G
Aavid, Thermal Division of Boyd Corporation
135
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SOLDERPIN 50.8MM
- Board Level, Vertical 2.000" (50.80mm) Bolt On and PC Pin TO-220 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W
7-339-4PP-BA
CTS Thermal Management Products
69
III dies
-
MOQ: 1  MPQ: 1
HEATSINK PWR W/PINS BLACK TO-220
7 Board Level, Vertical 2.500" (63.50mm) Bolt On and PC Pin TO-220 9.0W @ 40°C - 5.70°C/W
6398BG
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 PIN BLACK
- Board Level, Vertical 1.500" (38.10mm) Bolt On and PC Pin TO-220 4.0W @ 30°C 2.00°C/W @ 400 LFM 4.40°C/W
HS28
Apex Microtechnology
10
III dies
-
MOQ: 1  MPQ: 1
HEATSINK SIP
Apex Precision Power Board Level, Vertical 2.500" (63.50mm) Bolt On and PC Pin - - - -
529801B00000
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level 1.500" (38.10mm) Bolt On TO-218 5.0W @ 30°C 3.00°C/W @ 200 LFM 5.00°C/W