Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Odonata Lepidoptera products 2
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Shape Length Width Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HS01
Apex Microtechnology
422
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TOP MT TO-3
Top Mount Rhombus 1.600" (40.64mm) 1.000" (25.40mm) Bolt On TO-3 1.5W @ 20°C 2.00°C/W @ 600 LFM 11.60°C/W
HS28
Apex Microtechnology
10
III dies
-
MOQ: 1  MPQ: 1
HEATSINK SIP
Board Level, Vertical Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) Bolt On and PC Pin - - - -