- Series:
-
- Type:
-
- Material:
-
- Length:
-
- Width:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Electus conditionibus;
Odonata Lepidoptera products 12
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Advanced Thermal Solutions Inc. |
4,769
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | ASIC | - | 5.30°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
139
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | Thermal Tape, Adhesive (Not Included) | ASIC | - | 12.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
444
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | Thermal Tape, Adhesive (Included) | ASIC | - | 12.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
475
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | - | 5.30°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
372
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | ASIC | - | 4.00°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
73
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 58MM X 30MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 1.181" (30.00mm) | 2.283" (58.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | - | 4.80°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
62
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 58MM X 30MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Rectangular, Angled Fins | 2.283" (58.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | ASIC | - | 4.80°C/W @ 200 LFM | - | ||||
CUI Inc. |
988
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level | Aluminum Alloy | Rectangular | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | ||||
Advanced Thermal Solutions Inc. |
77
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 45MM X 9MM
|
maxiGRIP | Top Mount | Aluminum | Rectangular, Angled Fins | 0.827" (21.00mm) | 1.772" (45.00mm) | Clip | Flip Chip Processors | - | 6.10°C/W @ 200 LFM | - | ||||
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 3.7W @ 75°C | 6.84°C/W @ 200 LFM | 20.27°C/W | ||||
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level | Aluminum Alloy | Rectangular, Fins | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | TO-220 | 3.1W @ 75°C | 7.07°C/W @ 200 LFM | 24.19°C/W | ||||
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | ASIC | - | 4.00°C/W @ 200 LFM | - |