Odonata Lepidoptera products 12
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Material Shape Length Width Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
ATS-56001-C3-R0
Advanced Thermal Solutions Inc.
4,769
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 19MM X 19MM X 9MM
maxiFLOW Top Mount Aluminum Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Included) ASIC - 5.30°C/W @ 200 LFM -
ATS-56003-C4-R0
Advanced Thermal Solutions Inc.
139
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 15MM X 15MM X 9MM
maxiFLOW Top Mount Aluminum Square, Angled Fins 0.590" (14.99mm) 0.590" (14.99mm) Thermal Tape, Adhesive (Not Included) ASIC - 12.00°C/W @ 200 LFM -
ATS-56003-C1-R0
Advanced Thermal Solutions Inc.
444
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 15MM X 15MM X 9MM
maxiFLOW Top Mount Aluminum Square, Angled Fins 0.590" (14.99mm) 0.590" (14.99mm) Thermal Tape, Adhesive (Included) ASIC - 12.00°C/W @ 200 LFM -
ATS-56001-C4-R0
Advanced Thermal Solutions Inc.
475
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 19MM X 19MM X 9MM
maxiFLOW Top Mount Aluminum Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Not Included) ASIC - 5.30°C/W @ 200 LFM -
ATS-56000-C3-R0
Advanced Thermal Solutions Inc.
372
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 30MM X 30MM X 9MM
maxiFLOW Top Mount Aluminum Square, Angled Fins 1.181" (30.00mm) 1.181" (30.00mm) Thermal Tape, Adhesive (Included) ASIC - 4.00°C/W @ 200 LFM -
ATS-56009-C4-R0
Advanced Thermal Solutions Inc.
73
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 58MM X 30MM X 9MM
maxiFLOW Top Mount Aluminum Rectangular, Angled Fins 1.181" (30.00mm) 2.283" (58.00mm) Thermal Tape, Adhesive (Not Included) ASIC - 4.80°C/W @ 200 LFM -
ATS-56009-C3-R0
Advanced Thermal Solutions Inc.
62
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 58MM X 30MM X 9MM
maxiFLOW Top Mount Aluminum Rectangular, Angled Fins 2.283" (58.00mm) 1.181" (30.00mm) Thermal Tape, Adhesive (Included) ASIC - 4.80°C/W @ 200 LFM -
HSE-B2111-038
CUI Inc.
988
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220, 25
HSE Board Level Aluminum Alloy Rectangular 0.984" (25.00mm) 0.625" (16.00mm) Bolt On TO-220 3.8W @ 75°C 6.12°C/W @ 200 LFM 19.74°C/W
ATS-59000-C1-R0
Advanced Thermal Solutions Inc.
77
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK 21MM X 45MM X 9MM
maxiGRIP Top Mount Aluminum Rectangular, Angled Fins 0.827" (21.00mm) 1.772" (45.00mm) Clip Flip Chip Processors - 6.10°C/W @ 200 LFM -
HSE-B1711-032
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220, 25
HSE Board Level Aluminum Alloy Rectangular, Fins 0.984" (25.00mm) 0.625" (16.00mm) Bolt On TO-220 3.7W @ 75°C 6.84°C/W @ 200 LFM 20.27°C/W
HSE-B1711-057
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220, 25
HSE Board Level Aluminum Alloy Rectangular, Fins 0.984" (25.00mm) 0.625" (16.00mm) Bolt On TO-220 3.1W @ 75°C 7.07°C/W @ 200 LFM 24.19°C/W
ATS-56000-C4-R0
Advanced Thermal Solutions Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK 30MM X 30MM X 9MM
maxiFLOW Top Mount Aluminum Square, Angled Fins 1.181" (30.00mm) 1.181" (30.00mm) Thermal Tape, Adhesive (Not Included) ASIC - 4.00°C/W @ 200 LFM -