Odonata Lepidoptera products 12
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
658-60ABT1E
Wakefield-Vette
2,779
III dies
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.600" (15.24mm) 2.00°C/W @ 500 LFM - Black Anodized
658-60ABT4E
Wakefield-Vette
7,117
III dies
-
MOQ: 1  MPQ: 1
HEATSINK CPU 27.9MM SQ W/ADH BLK
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.598" (15.20mm) 2.00°C/W @ 500 LFM - Black Anodized
658-60AB
Wakefield-Vette
4,276
III dies
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/OTAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Not Included) BGA 0.598" (15.20mm) 2.00°C/W @ 500 LFM - Black Anodized
590102B03600G
Aavid, Thermal Division of Boyd Corporation
6,716
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/TABS 1.67"HIGH
- Board Level, Vertical Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) Bolt On and PC Pin TO-220 1.000" (25.40mm) 4.00°C/W @ 300 LFM 10.00°C/W Black Anodized
658-60ABT3
Wakefield-Vette
2,122
III dies
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.598" (15.20mm) 2.00°C/W @ 500 LFM - Black Anodized
C247-050-2VE
Ohmite
368
III dies
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-247 WITH 2 CLIPS
C Board Level, Vertical Rectangular, Fins 1.969" (50.00mm) 1.500" (38.10mm) 2 Clips and PC Pin TO-247 0.710" (18.03mm) 5.00°C/W @ 200 LFM - Degreased
C247-050-2AE
Ohmite
296
III dies
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-247 WITH 2 CLIPS
C Board Level, Vertical Rectangular, Fins 1.969" (50.00mm) 1.500" (38.10mm) 2 Clips and PC Pin TO-247 0.710" (18.03mm) 5.00°C/W @ 200 LFM - Black Anodized
628-40AB
Wakefield-Vette
562
III dies
-
MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.4"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.400" (10.16mm) 4.00°C/W @ 300 LFM - Black Anodized
7-199-BA
CTS Thermal Management Products
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK DUAL HORZ BLACK TO-220
7 Board Level Rectangular, Fins 1.450" (36.83mm) 0.780" (19.81mm) Bolt On TO-220 0.850" (21.60mm) - - Black Anodized
658-60ABT1
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.598" (15.20mm) 2.00°C/W @ 500 LFM - Black Anodized
658-60ABT2
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 28MM SQ BLK W/TAPE
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.598" (15.20mm) 2.00°C/W @ 500 LFM - Black Anodized
658-60ABT4
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 27.9MM SQ W/ADH BLK
658 Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) Thermal Tape, Adhesive (Included) BGA 0.598" (15.20mm) 2.00°C/W @ 500 LFM - Black Anodized