- Material：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|
|
|
CUI Inc. |
1,434
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 6.5W ALUMINUM
|
- | Board Level | Aluminum | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | 0.370" (9.40mm) | 3.76°C/W @ 200 LFM | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.500" (38.10mm) | 1.375" (34.93mm) | PC Pin | 0.500" (12.70mm) | 3.66°C/W @ 200 LFM | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION,TO-220, 38.
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.500" (38.10mm) | 1.260" (32.00mm) | PC Pin | 0.551" (14.00mm) | 3.62°C/W @ 200 LFM |
