- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 2
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Wakefield-Vette |
7,342
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLK
|
235 | Board Level | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 20.00°C/W | ||
|
|
|
CTS Thermal Management Products |
192
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 19.60°C/W |
