- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 7
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
1,848
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VRT MT BLK 1.5"
|
637 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.0W @ 65°C | - | Black Anodized | ||
|
|
|
CUI Inc. |
1,950
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 21.90°C/W | Tin | ||
|
|
|
CUI Inc. |
2,094
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 21.90°C/W | Tin | ||
|
|
|
CUI Inc. |
2,094
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 21.90°C/W | Tin | ||
|
|
Advanced Thermal Solutions Inc. |
4,314
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 29MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.142" (29.01mm) | 1.142" (29.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 29X29X19.5MM W/OUT TIM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.142" (29.01mm) | 1.142" (29.01mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.768" (19.50mm) | - | - | Black Anodized | |||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MT BLK 1.5"
|
637 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 6.0W @ 65°C | 10.80°C/W | Black Anodized |
