manufacturer:
Series:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Odonata Lepidoptera products 2
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
272-AB
Wakefield-Vette
6,156
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SM FOOTPRINT BLK
272 Board Level Rectangular, Fins 1.450" (36.83mm) 1.750" (44.45mm) - Bolt On and PC Pin TO-220, TO-202 0.375" (9.52mm) 4.0W @ 42°C 3.60°C/W @ 400 LFM
4-1542005-0
TE Connectivity AMP Connectors
357
III dies
-
MOQ: 1  MPQ: 1
HEAT SINK BGA 25MM 7FIN RADIAL
- - Cylindrical - - 1.375" (34.92mm) OD Clip BGA 0.894" (22.71mm) - 3.80°C/W @ 200 LFM