- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 6
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,556
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-92 .72" BLK
|
Board Level, Vertical | Rectangular, Fins | 0.602" (15.29mm) | - | - | Press Fit | TO-92 | 0.720" (18.29mm) | 0.3W @ 20°C | 17.50°C/W @ 400 LFM | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,993
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level | Rectangular, Fins | 0.984" (25.00mm) | 0.472" (12.00mm) | - | Bolt On | TO-220 | 0.177" (4.50mm) | - | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
421
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TO-5 PUSH-ON HEATSINK 6.35MM
|
Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
25
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level | Rectangular, Fins | 0.984" (25.00mm) | 0.472" (12.00mm) | - | Bolt On | TO-220 | 0.177" (4.50mm) | - | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Top Mount | Rectangular, Fins | 0.750" (19.05mm) | 0.604" (15.34mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.212" (5.39mm) | 0.6W @ 40°C | 60.00°C/W @ 100 LFM | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | Red Anodized |
