- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Ohmite |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 50MM DEGREASED
|
CR | Aluminum Alloy | 1.969" (50.00mm) | 2.953" (75.00mm) | 3 Clips and PC Pin | TO-201 | - | - | - | Degreased | ||
|
|
|
Ohmite |
22
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 50MM BLK ANODI
|
CR | Aluminum Alloy | 1.969" (50.00mm) | 2.953" (75.00mm) | 3 Clips and PC Pin | TO-201 | - | - | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Aluminum | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 8.0W @ 40°C | 1.00°C/W @ 700 LFM | Black Anodized |
