- Series：
-
- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 14
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Ohmite |
209
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 3 CLIPS
|
C | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 3 Clips and PC Pin | TO-247 | 0.710" (18.03mm) | 2.5W @ 20°C | 2.00°C/W @ 300 LFM | - | ||
|
|
|
Wakefield-Vette |
701
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18X75MM 3-CLIP TO-220
|
OmniKlip | Board Level, Vertical | Aluminum | 0.710" (18.03mm) | Clip, Solder Foot | TO-220 | 1.500" (38.10mm) | - | - | - | ||
|
|
|
Wakefield-Vette |
742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL TO HEATSINK 41X75MM
|
OmniKlip | Board Level, Vertical | Aluminum | 1.614" (41.00mm) | Clip, Solder Foot | TO-247, TO-264 | 2.480" (62.99mm) | - | - | - | ||
|
|
|
ASSMANN WSW Components |
131
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | 1.811" (46.00mm) | Bolt On | TO-220 | 1.299" (33.00mm) | - | - | - | ||
|
|
|
Ohmite |
135
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIPS FOR 3 TO-220
|
C | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 3 Clips and PC Pin | TO-220 | 0.710" (18.03mm) | - | - | - | ||
|
|
|
Wakefield-Vette |
891
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18X75MM TO-247 TO-264
|
OmniKlip | Board Level, Vertical | Aluminum | 0.710" (18.03mm) | Clip, Solder Foot | TO-247, TO-264 | 1.500" (38.10mm) | - | - | - | ||
|
|
|
Ohmite |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 75MM BLK ANODI
|
CR | Board Level, Vertical | Aluminum Alloy | 1.969" (50.00mm) | 3 Clips and PC Pin | TO-101 | - | - | - | 4.20°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-247 TO-264 TO-220
|
OmniKlip | Board Level, Vertical | Aluminum | 1.063" (27.00mm) | Clip, Solder Foot | TO-220, TO-247, TO-264 | 1.969" (50.00mm) | - | - | - | ||
|
|
|
Ohmite |
22
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 75MM BLK ANODI
|
CR | Board Level, Vertical | Aluminum Alloy | 2.362" (60.00mm) | 2 Clips and PC Pin | TO-301 | - | - | - | 4.50°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-247 TO-264 TO-220
|
OmniKlip | Board Level, Vertical | Aluminum | 1.181" (30.00mm) | Clip, Solder Foot | TO-220, TO-247, TO-264 | 2.362" (60.00mm) | - | - | - | ||
|
|
|
Ohmite |
23
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 75MM BLK ANODI
|
CR | Board Level, Vertical | Aluminum Alloy | 2.953" (75.00mm) | 3 Clips and PC Pin | TO-201 | - | - | - | 2.60°C/W | ||
|
|
|
Ohmite |
21
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM HEATSINK 75MM BLK ANODI
|
CR | Board Level, Vertical | Aluminum Alloy | 2.953" (75.00mm) | 2 Clips and PC Pin | TO-401 | - | - | - | 3.00°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-247 TO-264 TO-220
|
OmniKlip | Board Level, Vertical | Aluminum | 1.339" (34.00mm) | Clip, Solder Foot | TO-220, TO-247, TO-264 | 2.953" (75.00mm) | - | - | - | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-247 TO-264 TO-220
|
OmniKlip | Board Level, Vertical | Aluminum | 1.575" (40.00mm) | Clip, Solder Foot | TO-220, TO-247, TO-264 | 2.953" (75.00mm) | - | - | - |
