- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 8
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Rectangular, Fins | 1.020" (25.91mm) | Clip | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Rectangular, Fins | 1.000" (25.40mm) | Bolt On | TO-220 | 0.380" (9.65mm) | 2.0W @ 40°C | 4.00°C/W @ 700 LFM | 20.80°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-202 CLIP-ON 5W
|
Board Level | Rectangular | 1.020" (25.91mm) | Clip | TO-202 | 0.420" (10.67mm) | 1.0W @ 20°C | 8.00°C/W @ 200 LFM | 16.80°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Rectangular, Fins | 0.745" (18.92mm) | Clip | TO-202 | 0.420" (10.67mm) | 1.5W @ 40°C | 6.00°C/W @ 700 LFM | 24.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 1.020" (25.91mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 1.020" (25.91mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 0.745" (18.92mm) | Clip | TO-202 | 0.420" (10.67mm) | 1.5W @ 40°C | 11.00°C/W @ 400 LFM | 24.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Rectangular, Fins | 1.020" (25.91mm) | Clip and PC Pin | TO-202 | 0.420" (10.67mm) | 3.0W @ 50°C | 8.00°C/W @ 200 LFM | 16.80°C/W |
