- Series：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 11
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,329
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 12W H=1.25" BLK
|
- | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 2.00°C/W @ 400 LFM | 5.00°C/W | ||
|
|
|
Apex Microtechnology |
381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 8P TO-3 4.5C/W
|
Apex Precision Power | TO-3 | 1.500" (38.10mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 4.50°C/W | ||
|
|
|
Wakefield-Vette |
161
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK POWER TO-3 BLK
|
680 | TO-3 | 1.250" (31.75mm) | 7.5W @ 45°C | 1.50°C/W @ 400 LFM | 6.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,911
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 10W H=.50" BLK
|
- | TO-3 | 0.500" (12.70mm) | 6.0W @ 50°C | 2.50°C/W @ 400 LFM | 7.20°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
201
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | TO-3 | 0.750" (19.05mm) | 4.0W @ 30°C | 2.50°C/W @ 400 LFM | 6.20°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 1.50°C/W @ 600 LFM | 5.10°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | TO-3 | 0.750" (19.05mm) | 12.0W @ 70°C | 1.50°C/W @ 700 LFM | 6.20°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | TO-3 | 1.000" (25.40mm) | 6.0W @ 40°C | 1.50°C/W @ 700 LFM | 6.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | TO-3 | 1.000" (25.40mm) | 6.0W @ 40°C | 1.50°C/W @ 700 LFM | 5.80°C/W | ||
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PASSIVE ALUMINUM BLACK
|
680 | TO-3 | 0.750" (19.05mm) | 7.5W @ 58°C | 2.40°C/W @ 400 LFM | - | |||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 OMNIDIRECT BLK
|
680 | TO-220 (Dual) | 1.250" (31.75mm) | 7.5W @ 45°C | 1.50°C/W @ 400 LFM | - |
