- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,215
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
0.520" (13.21mm) | 0.515" (13.08mm) | 1.0W @ 30°C | 6.00°C/W @ 500 LFM | 19.70°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
0.900" (22.86mm) | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 13.1X13.2X24MM
|
0.520" (13.21mm) | 0.515" (13.08mm) | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | - |
