manufacturer:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Odonata Lepidoptera products 2
Image part manufacturer quantitas partus tempus Unit Price buy Description Shape Length Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
ATS-PCB1041
Advanced Thermal Solutions Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
HEATSINK TO-220
Rectangular, Fins 1.644" (41.76mm) TO-220 - 3.80°C/W @ 200 LFM
575803B00000G
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Rhombus 1.630" (41.40mm) TO-3 5.0W @ 50°C 3.50°C/W @ 200 LFM