- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Shape | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Shape | Length | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,307
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MNT W/TABS
|
Rectangular, Fins | 1.250" (31.75mm) | Bolt On and PC Pin | 0.250" (6.35mm) | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | 22.00°C/W | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
|
Rectangular, Angled Fins | 0.211" (5.35mm) | PC Pin | 1.250" (31.75mm) | 2.9W @ 75°C | 8.18°C/W @ 200 LFM | 26.13°C/W | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 22.2X5.4X30.3MM
|
Rectangular, Fins | 1.193" (30.30mm) | Bolt On and PC Pin | 0.211" (5.35mm) | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | - |
