manufacturer:
Series:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Odonata Lepidoptera products 2
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Length Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
OMNI-UNI-41-75
Wakefield-Vette
742
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL TO HEATSINK 41X75MM
OmniKlip Board Level, Vertical 2.953" (75.00mm) Clip, Solder Foot TO-247, TO-264 2.480" (62.99mm) - - Black Anodized
ATS-EXL72-300-R0
Advanced Thermal Solutions Inc.
19
III dies
-
MOQ: 1  MPQ: 1
HEATSINK AL6063 300X41X7MM
- Top Mount 11.800" (299.72mm) Adhesive - 0.275" (7.00mm) 17.70°C/W @ 200 LFM 47.40°C/W Degreased