- Series:
-
- Material:
-
- Length:
-
- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
- Electus conditionibus;
Odonata Lepidoptera products 6,196
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
306
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X25MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 2.18°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
118
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X10MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 14.20°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
298
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X15MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 4.44°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
105
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X25MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 5.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
166
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X10MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 14.20°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
49
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X70X15MM
|
- | Top Mount | Aluminum | Rectangular, Fins | 11.800" (299.72mm) | Adhesive | - | 0.590" (15.00mm) | 2.40°C/W @ 200 LFM | 18.20°C/W | Degreased | ||||
Delta Electronics |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY LGA2011 NARROW
|
- | Board Level | Aluminum | Rectangular, Fins | 4.173" (106.00mm) | Bolt On | LGA | 1.004" (25.50mm) | - | 0.26°C/W | - | ||||
ASSMANN WSW Components |
96
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | Rectangular, Fins | 0.591" (15.01mm) | Bolt On | TO-220, TOP-3 | 0.984" (25.00mm) | - | 5.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
47
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X6MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | 10.50°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
89
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 7.42°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
92
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X20MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 3.00°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
79
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X25MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 5.31°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
45
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 6.27°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
53
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X12.7MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 12.24°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
33
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X15MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 10.58°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
63
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X20MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 7.57°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
98
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X12.7MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 12.24°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
97
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X15MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 10.58°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
91
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X20MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 7.57°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
96
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 70X70X20MM XCUT T766
|
pushPIN | Top Mount | Aluminum | Square, Fins | 2.756" (70.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 7.57°C/W @ 100 LFM | - | Blue Anodized |