Material:
Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
Odonata Lepidoptera products 10
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Material Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
667-10ABPPE
Wakefield-Vette
1,943
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS
- - - - - - - - - - -
667-10ABSP
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
Board Level, Vertical Aluminum Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) Bolt On and PC Pin TO-220 1.000" (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM Black Anodized
667-10ABSPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-15ABPPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-15ABSPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-20ABPPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-20ABSPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-25ABPPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-25ABSPE
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/S/O PINS BLK
- - - - - - - - - - -
667-10ABPP
Wakefield-Vette
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/PINS
Board Level, Vertical Aluminum Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) Bolt On and PC Pin TO-220 1.000" (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM Black Anodized