Odonata Lepidoptera products 5
Image part manufacturer quantitas partus tempus Unit Price buy Description Length Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HSE-B18254-0396H
CUI Inc.
592
III dies
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MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION,TO-218, 25.
1.000" (25.40mm) 8.2W @ 75°C 2.29°C/W @ 200 LFM 9.15°C/W
HSE-B18318-0396H
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION,TO-218, 31.
1.250" (31.75mm) 9.1W @ 75°C 2.57°C/W @ 200 LFM 8.24°C/W
HSE-B18381-0396H
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-218, 38
1.500" (38.10mm) 10.8W @ 75°C 2.29°C/W @ 200 LFM 6.94°C/W
HSE-B18508-0396H
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-218, 50
2.000" (50.80mm) 12.8W @ 75°C 2.45°C/W @ 200 LFM 5.86°C/W
HSE-B18635-0396H
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-218, 63
2.500" (63.50mm) 13.7W @ 75°C 2.78°C/W @ 200 LFM 5.47°C/W